Base plate ASUS ROG 1200 Maximus XIII Extreme Glacial

Base plate ASUS ROG 1200 Maximus XIII Extreme Glacial

ROG Maximus XIII Extreme Glacial is fully armed for those who want to drive the latest Intel Core 11-generation processors to the end of performance. It has the latest hardware and software that work in unison to optimize your overclocking experience, as well as artificial intelligence improvements and comprehensive cooling controls to provide complete control over your construction.

ROG X EK Ultrablock

The cold EK UltraBlock plate is made of pure electrolytic copper that is coated with nickel to prevent oxidation. The coolant is directed through milled pathways passing through the CPU, the M.2 slot of the medium plate, PCH and VRM in sequence, prioritizing the cooling where it is most needed. Integrated sensors in the flow rate of the input and output current and temperature statistics directly to the Fan Xpert 4 software, allowing custom cooling profiles for the best performance and acoustic balance. The final touch is provided by the directional RGB lighting that blooms through plexiglass panels located at the opposite ends of the block.

ACTION

The delivery of radical power and patented improvements for overclocking allow you to adapt the capabilities of your chosen CPU to your will, as well as the carefully designed tubes in your custom loop.

ENERGY SOLUTION

• Equipment energy architecture

Modern CPU architectures increase the commitment to the base plate\'s energy design by moving from deep energy saving modes to full load almost instantly. The latest ROG VRM architecture is up to the challenge by using team power stages to quickly change the current while maintaining exemplary thermal performance.

• A change in CPU requirements

Today\'s CPU contains more cores than its predecessors, and the latest sets of instructions allow them to process computer-dense workloads at an incredible rate. As an additional benefit, these processors also consume less energy at rest and can make the transition between loading states much faster. These improvements required a reassessment of energy design priorities, because phase duplicators add a spread delay that makes it difficult to respond transitory.

• Combined power stages

The latest integrated power components can handle higher currents than old devices, making it possible to implement a simple circuit topology that is not hampered by the processing delay of phase duplicators. This is why the ROG Maximus XIII Extreme Glacial uses combined power stages to deliver a higher phase-by-phase flow while maintaining the thermal performance of the double phase designs.

• Thermal performance

Each component of VRM has a specific purpose. PWM drivers control the circuit and power stages do the heavy work from an electric and thermal point of view. That\'s why ROG Maximus XIII Extreme Glacial uses 18 power stages. High-end power stages have a low RDSON to reduce switching and driving losses, which helps improve the overall thermal margin.

HIGH QUALITY COMPONENTS

• 8-pin ProCool II double power connectors

Two ProCool connectors ensure a secure and reliable connection to the EPS 12V power lines.

• Power phase Infineon TDA21490

The VRM has 18 power stages of 100 amperes each for the Vcore and two power stages of 100 amperes for secondary voltage rails.

• MicroFine Alloy Chokes

Each power stage is accompanied by a high permeability alloy core strangler classified to handle 45 ampers.

• 10K Japanese made black metal condensers

The input and output filtering is provided by solid polymer capacitors classified to last thousands of hours at high operating temperatures.

MEMORIA

• ASUS OptiMem III

With patented memory tracking design settings that improve signal integrity and mitigate noise, OptiMem III allows memory kits to run at lower latences and reduced voltages while operating at higher frequencies. Pila ROG Maximus XIII Extreme Glacial with your favorite modules and maximize the performance of the 11th Intel Core Rocket Lake processor for applications that require wide bandwidth.

• RAMCache III

The utility of RAMCache III software converts milliseconds into microseconds to increase the speed of the loading times of the game. Fully compatible with the latest NVM Express storage options, RAMCache III uses a unique smart technology to effectively store any storage device in cache, so the favorite games and applications start at fast speeds.

CONECTIVITY

Advanced connectivity functions, including WiFi 6E and two Ethernet ports, provide all the bandwidth you need for a free online game and LAN. File transfers and loading times also increase thanks to Thunderbolt 4 USB-C technology. There is also integrated SupremeFX audio for a rich premium sound.

REDES

• Intel WiFi 6E (Gig +)

The WiFi 6E technology on board takes advantage of the radio spectrum recently available in the 6 GHz band, providing up to three times the 5 GHz band bandwidth and up to seven 160 MHz bands to offer ultra-fast wireless network speeds along with improved capacity and better performance. in dense wireless environments.

• Marvell AQtion Ethernet 10 Gbps

Designed to meet the demanding requirements of advanced users and content creators, 10 Gbps integrated Ethernet provides a new level of domestic networks. With up to 10 times the standard Ethernet Gigabit bandwidth, you will enjoy uncompressed 4K UHD video transmission and system backup and file transfers that are faster than ever.

• Intel 2.5 Gb Ethernet

The integrated 2.5 Gb Ethernet gives a boost to your cable connection, with an improvement of up to 2.5 times with respect to the standard Ethernet connections for faster file transfers, no more fluid games and high resolution video transmission.

USB

• USB 3.2 Gen 2x2 front panel connector

The latest USB standard opens another 3.2 Gen 2 USB lane for maximum data transfer performance of up to 20 Gbps. The USB-C design also ensures compatibility with a wide range of devices.

• USB 3.2 Gen 2 front panel connectors

Two USB 3.2 connectors on the front panel are ready to adapt to a wide variety of devices.

Two integrated Thunderbolt 4 USB-C ports
Each port offers up to 40 Gbps of two-way bandwidth for the latest high-speed devices and units. Thunderbolt 4 also supports up to two external 4K screens and extends the PCIe bandwidth to 32 Gbps.

STORAGE

• Ready for PCIe 4.0

ROG Maximus XIII Extreme Glacial is equipped with four integrated M.2 slots, and two of them offer PCIe 4.0 support for the latest high-speed GPU and SSD. To deal with the heat generated by high-performance M.2 SSD, each unit is protected by a dedicated M.2 thermal dissipator and an integrated back plate.

• ROG DIMM.2

The ROG DIMM.2 module is an innovative expansion card that allows you to connect two M.2 units through a DDR4 interface. Then you can add metal heat dissipators, which helps control the thermal to get the maximum performance while improving the aesthetics.

Specifications:

• Technical details
  • Format: Extended ATX
  • Chipset: Intel Z590
  • MultiGPU: 2-Way NVIDIA SLI
  • Number of PCI Express slots: 3
  • Processor family: Intel
  • Support hard drive interfaces: M.2 PCIe, Serial ATA III
  • Number of supported processors: 1
  • Number of DIMM slots: 4
• Processor
  • processor socket: Socket 1200
  • Processor family: Intel Celeron, Intel Core i3 - 10th Gen, Intel Core i3 - 11th Gen, Intel Core i5 - 10th Gen, Intel Core i5 - 11th Gen, Intel Core i7 - 10th Gen, Intel Core i7 - 11th Gen, Intel Core i7 - 11th Gen, Intel Core i9 - 10th Gen, Intel Core i9 - 11th Gen, Intel Core i9 - 11th Gen, Intel Pentium
• Memory
  • Memory Slots: 4x DIMM
  • Type of memory slots: DIMM
  • Maximum internal memory: 128 GB
  • Memory module capabilities supported: 32 GB
  • ECC No
  • Memory without buffer
  • Memory channel support: Dual
  • compatible memory types: DDR4-SDRAM
  • Memory-watch speeds supported: 2133 MHz, 2400 MHz, 2666 MHz, 2800 MHz, 2933 MHz, 3000 MHz, 3200 MHz, 3333 (OC), 3400 (OC), 3466 (OC), 3600 (OC), 3733 (OC), 3866 (OC), 4000 (OC), 4133 (OC), 4266 (OC), 4400 (OC), 4500 (OC), 4600 (OC), 4700 (OC), 4800 (OC), 5000 (OC), 5133 (OC),
• Video
  • Maximum resolution: 4096 x 2160 Pixels
• Audio
  • Audio system: Realtek ALC ALC4082
• Expansion slots
  • PCI Express Configurations: 1 x1, 2 x16
  • Number (total) of PCI Express slots: 3
  • x1 PCI Express slots: 1
  • Slots x16 PCI Express: 2
  • PCI Express input version: 3.0, 4.0
• Internal I / O
  • EPS power connector (8-pin): 2
  • CPU fan connector: Yes
  • ATX power connector (24 pins): Yes
  • Front panel audio connector: Yes
  • Jumper Clear CMOS: Yes
  • Fan connector: Yes
  • USB 2.0 connectors: 2
  • USB connectors 3.2: 2
  • USB C: 2 connectors
  • Number of chassis fan connectors: 2
  • Number of SATA 3: 6 connectors
  • M.2: 3 connectors
  • RGB / LED Shoe Connectors: 4
  • Connector for Thunderbolt: 2
• Back panel Ports of I / O (Input / Output)
  • Speaker, headset, output jack: 5
  • Number of HDMI ports: 1
  • Number of USB ports 3.2: 8
  • Number of Thunderbolt ports: 2
  • Ethernet (RJ-45): 2
  • Port of departure S / PDIF: 1
• Network
  • Bluetooth
  • Network characteristics: 10 / 100 / 1000 / 10000 Mb / s, 10 / 100 / 1000 / 2500 Mb / s
  • Network connection
  • LAN controller: Marvell 10Gb Ethernet
  • Ethernet
  • Standard WiFi: IEEE 802.11a, IEEE 802.11ac, IEEE 802.11ax, IEEE 802.11az, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n
  • Bluetooth version: 5.2
  • Wi-Fi
• BIOS
  • BIOS button switch
  • BIOS, memory size: 2x 256 MB
  • Types of BIOS: UEFI AMI
• Weight and dimensions
  • Width: 30.5 cm
  • Depth: 27.7 cm
• Packaging content
  • Material included: Wire, Sticker, SATA, M.2 screws