Gigabyte X670 Aorus Elite AX AM5 Base Plate

Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate, Img
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate, Img 1
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate, Img 2
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate, Img 3
Gigabyte X670 Aorus Elite AX AM5 Base Plate
Gigabyte X670 Aorus Elite AX AM5 Base Plate, Img 4
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Gigabyte X670 Aorus Elite AX AM5 Base Plate

UNMATCHED PERFORMANCE

With the following changes, GIGABYTE always follows the latest trends and gives clients advanced functions and the latest technological &uteases. The GIGABYTE base plates are equipped with an improved energy performance &o., the latest storage standards and exceptional connectivity to enable optimized gaming performance.

DISE Ñ OR 8 + 8 Fases

Dise ñ or TWIN Digital VRM

To ensure the maximum performance of Turbo Boost and overclocking of AMD's new-generation CPU, the GIGABYTE AORUS base number plate series equips the best ñ or VRM jam &arecars built with high quality components.

DISE Ñ OR PCIE 5.0

Ready for PCIE 5.0

PCIe 5.0 Design supports double the bandwidth of PCIe 4.0 and ensures compatibility with SSD and the latest generation &o GPU launched in the next to ñ s to its maximum capacity.

Ultra Durable SMD PCIe 5.0 x4 M. 2 Connector

The first PCIe 5.0 x4 M. 2 slot is compatible with the recent M. 2 25110 m form factor. PCIe 5.0 M. 2 connectors reinforced with met &aemical shielding to provide greater resistance.

New Generation PCIe 5.0 SMD Ultra Durable Armor

The new generation &oacutin, the PCI-e stainless steel shield unique to GIGABYTE, is returned 20% m wide, which provides greater resistance to the tractor.

EXPO AND XMP SUPPORT

Ultra Durable SMD DDR5 Memory Armor

Dise ñ or GIGABYTE exclusive stainless steel shield.

Armored memory routing

All memory routing is below the internal layer of the PCB protected by a large layer of land to protect it from external interference.

EXPO and XMP dual support

GIGABYTE AM5 MB is compatible with the AMD EXPO and Intel XMP overclocking memory modules for a maximum compatibility. {\cs6\f1\cf6\lang1024} IBM {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024}

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DDR5 &aaitic self-amplifier

Auto-increases the native DDR5 frequency to 5000MHz while the system is under heavy load with a single click.

EXPO and XMP 3.0 user profile

Define and create your own SPD profile in m &onodules Native, EXPO, and XMP 3.0. A user-defined profile can be saved, loaded locally, or from/to an external storage device.

ACTIVE OC TUNER BIOS

6.8% increase in performance

With the BIOS function of the BIOS Active OC Tuner exclusive of GIGABYTE, the CPU can work with AMD PBO for games and other light workload applications with the highest CPU boost, but when the applications require all the power of the CPU's n &uanties, it changes autom to the manual OC mode where you can use the high frequency for all of the CPU's n &uanties.

EXCELLENT PERFORMANCE T &EVERY RMICO

The unrivaled performance of the GIGABYTE base plates is guaranteed by an innovative and optimized Dise ñ or t &eUde; to ensure the best CPU, chipset and SSD stability and low temperatures under full load and gaming performance applications.

GIGABYTE ADVANCED &O N T &O N &O N &O N

Fins-Array III

The new generation of GIGABYTE's Fins-Array III generation offers the maximum performance t &eacermic performance by using extended irregular fins to fill all available space and greatly increase the surface area. A piece of the surface area of the Fins-Array III heat sink is greater than 2 Tama ñ or full ATX ATX motherboard PCBs, thereby greatly increasing the thermal efficiency and performance of heat exchange.

Nanocarbon coated fins array heat sink

As the CPUs become powerful, the VRM dules are heated to an ultra high performance. To be the first to adopt among the industry that uses NanoCarbon as coating material to improve radiation and to accelerate the dissipation of heat. The nanocarbon is coated on the heat sink by means of an electrostatic adhesive. The coating material covers the entire heat sink with fins with a thickness of 200 μ m. In this way, the heat dissipates m &arecuently.

PERFORMANCE WITHOUT ACCELERATION Ó

M. 2 Thermal Guard III

M. 2 Thermal Guard III built with an optimized 9X heat-dissipation surface to avoid bottlenecks and bottlenecks that can cause the high speed/large capacity of the PCIe 5.0 M. 2 SSDs, especially under a large workload. The ñ or special of the heat sink slots in the CPU direction improves the air flow in the chassis and optimizes the heat convection efficiency.

SOFTWARE

Smart Fan 6

Smart Fan 6 contains several úal cooling features that ensure that the gaming PC maintains its performance while remaining cool and silent.

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Noise detection

With the new noise detection function, you can control the noise level of all devices, including fans, CPU dissipation, grt cards, etc. in real time, and you can determine what the speed of your fan should be.

CONNECTIVITY

GIGABYTE motherboards allow for the best connection experience with data transfer rates that are easy to bring to the network, storage and Wi-Fi connectivity for the next generation.

WI-FI

Wi-Fi 802.11ax 6E

The latest 6 GHz dedicated band 802.11ax Wi-Fi 6E with new dedicated 6 GHz band allows for a smooth performance of gigabits, provides a smooth video stream, a better gaming experience, few interrupted connections, and speeds of up to 2.4 Gbps. In addition, Bluetooth 5 provides a 4X scope over BT 4.2 and with a transmission &oatun m &aascias.

The best virtual reality experience

Wi-Fi 6E provides speeds of Wi-Fi m &aplicas r &aplidas, lower latency and better duration of the battery &iacas a for virtual reality devices, which means that the transmission of virtual reality games from your PC to your virtual reality device offers videos a lot of fluids and higher quality.

Wi-Fi Advantage 6E

Spectrum congestion is a big problem in the current Wi-Fi environment because too many devices use the existing 2.4GHz and 5 GHz spectrum, and cause unreliable connection and slow speed. Wi-Fi 6E is a series of Wi-Fi 6, and uses a dedicated 6 GHz band that provides not only a new frequency to transfer data, but also a wide spectrum for devices in the future. With Wi-Fi 6E, users can enjoy a connection &aocatos r &aetuas and una ñ m &aente; s strong as before.

ETHERNET

2 times m &aalcess r &aaipido i never

The adoption of LAN 2.5G provides network connectivity of up to 2.5 GbE, with transfer rates at least 2 times m &aecides r &aecidades in comparison with the 1 GbE general networks, perfectly dise ñ ed for players with the best gaming experience in the line. Supports RJ-45 multigigabit Ethernet (10/100/1000/2500 Mbps).

USB

USB 3.2 Gen 2x2 Type-C

With the ñ or USB 3.2 Gen 2x2 that doubles performance as the previous generation of USB 3.2 Gen 2. It works with an ultra-fast data transfer &aecatos up to 20 Gbps while connecting to USB 3.2-compliant rich perif. Through the USB Type-C connector, users can enjoy the flexibility of the reversible connection to access and store large amounts of data.

Rear USB 3.2 Gen 2 Type-C with DisplayPort alternate mode

DisplayPort a trav s USB Type-C allows for full performance delivery of DisplayPort A/V (4K and m &aasties control monitor resolutions), 10 Gbps USB SuperSpeed data transfer (USB 3.2 Gen 2), and power delivery with the reversible plug orientation and cable management comfort.

HI-FI AUDIO

Actual high-fidelity (Realtek ALC1220)

Along with Realtek's last c &odeutos dec ALC1220, the audio playback &obution with surround sound and SDS enabled music is m &arecuds f &arectit as never.

Cedge-of-the-udder-grade ondeners

To ensure an experience with study quality, WIMA and Fine Gold capacitors are used to provide power to the entire system.

High-resolution audio &oatun

High-resolution audio certificate &oatucn, which means that the product is capable of reproducing frequencies of up to 40 kHz or m &aws, which guarantees the user the best audio quality at all times.

DTS: X Ultra

Recreates a 3D and spatially accurate 3D audio experience to play with any headphone or speaker. Supports channel, scene, and object-based audio. It provides ready-to-use calibration for a variety of headphones and speakers. Provides post-processing and device-level tuning enhancements for the DTS c óals. DTS Sound Unbound takes advantage of Microsoft Spatial, which enables the 3D audio experience to be created for the games. The dive &oatóna a trav &eacuts of DTS Headphone :X means that in the soundscape, the stationary and moving sounds can be heard from above, below or around the listener. The sounds pass through the listener with a surprising externalization and an accurate location.

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