Thermaltake TG-30 4G Thermal Pasta

Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img 1
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img 2
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img 3
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img 4
Thermaltake TG-30 4G Thermal Pasta
Thermaltake TG-30 4G Thermal Pasta, Img 5
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(2.000 Kg.)

You will receive your order within 5 - 6 days if you do it from Monday to Friday before 18 pmView options

Pasta T &eaceras rmica Thermaltake TG-30 4G

TG-30 is a premium compound t &eacerus for a high cooling performance &ndar dise ñ to reduce CPU temperatures effectively.

High conductivity t &erenmic

The chemical compound contains diamond dust, which provides a 4.5 W/mk thermal conductivity t that can be used to meet the primary needs of the user.

F &aetucil to apply

The specially formulated thermal composite of Thermaltake fits perfectly with the honeycomb template, which provides an easy way to apply your thermal composite to obtain a clean, well-covered surface that adapts to all the CPUs.

All-in-One Application Kit

This rmico composite application kit includes a set of tools for immediate use.

Sustainability and security

High-quality thermal composite t &e provides a life &util til extended s to eliminate drying or cracking during use. The non-conductive composite provides better security measures for you and your system.